- 19" (pack of 5
The RackSolutions HotLok 2U Filler Panel is designed to effectively seal openings in IT equipment cabinets and control airflow for optimized cooling effectiveness. This HotLok filler/blanking panel reduces hotspots and bypass airflow by preventing equipment exhaust air or hot aisle air from migrating to the conditioned air intake stream at the front of the cabinet. It also facilitates the movement of lower temperature air to the upper one-third of the cabinet, which is typically the hottest area. Cantilevered sealing vanes eliminate the gap between adjoining filler/blanking panels or with installed equipment. It has an interlocking design that allows secure stacking for easy storage and convenient carrying, ensuring efficient use of space in datacenters. Its ergonomic finger grips allow easy-pull removal in standard EIA-310-E openings. For additional convenience, it offers a tool-free, snap-in installation and requires no additional parts or components for installation.