The mesh common bonding network (MCBN) (a.k.a. Mesh-BN) shall be installed beneath the access floor. The MCBN shall be constructed of a minimum of #6 AWG bare copper class B conductors. The conductors shall be installed in a grid pattern. At each conductor intersection, the conductors shall be in direct contact with one another and be bonded to each other by a single grounding clamp. The grounding clamp shall create a bond to the access floor by bonding the pedestals to the MCBN conductors. MCBN grid shall be on minimum ten foot centers. All metallic elements shall be bonded to the MCBN, including rack/cabinet jumpers, cable pathways, water pipes and HVAC units. The access floor grounding clamp shall be TIA-607-B compliant, listed for grounding with a nationally recognized testing laboratory, capable of withstanding fault currents, and RoHS compliant.