Panduit BICSI/J-STD-607-A Telecommunications Grounding Busbar - grounding plate
Mfg # GB2B0304TPI-1
CDW # 1667378
Know your gear
Featuers
* Meets BICSI and J-STD-607-A requirements for network systems grounding applications
* Made of high conductivity copper and tin-plated to inhibit corrosion
* Comes pre-assembled with brackets and insulators attached for quick installation
* Use PANDUIT self-laminating laser/ink jet labels to identify busbars to meet TIA/EIA-606-A, see chart below
*Busbar labels sold separately.
* Meets BICSI and J-STD-607-A requirements for network systems grounding applications
* Made of high conductivity copper and tin-plated to inhibit corrosion
* Comes pre-assembled with brackets and insulators attached for quick installation
* Use PANDUIT self-laminating laser/ink jet labels to identify busbars to meet TIA/EIA-606-A, see chart below
*Busbar labels sold separately.